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NZ9F2V4ST5G SERIES Zener Voltage Regulators
200 mW SOD-923 Surface Mount
This series of Zener diodes is packaged in a SOD-923 surface mount package. They are designed to provide voltage regulation protection and are especially attractive in situations where space is at a premium. They are well suited for applications such as cellular phones, hand held portables, and high density PC boards.
Specification Features
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* Standard Zener Breakdown Voltage Range -2.4 V to 18 V * Steady State Power Rating of 200 mW * Small Body Outline Dimensions: * * * *
0.039 x 0.024 (1.00 mm x 0.60 mm) Low Body Height: 0.016 (0.40 mm) ESD Rating of Class 3 (>16 kV) per Human Body Model Tight Tolerance VZ These are Pb-Free Devices
2
1 Cathode
2 Anode
MARKING DIAGRAM
1 X MG G
Mechanical Characteristics CASE: Void-free, transfer-molded, thermosetting plastic
SOD-923 CASE 514AB
1
2
Epoxy Meets UL 94, V-0 LEAD FINISH: 100% Matte Sn (Tin) MOUNTING POSITION: Any
QUALIFIED MAX REFLOW TEMPERATURE: 260C
X = Specific Device Code M = Month Code G = Pb-Free Package (Note: Microdot may be in either location)
Device Meets MSL 1 Requirements
MAXIMUM RATINGS
Rating Total Device Dissipation FR-5 Board, (Note 1) @ TA = 25C Derate above 25C Thermal Resistance from Junction-to-Ambient Junction and Storage Temperature Range Symbol PD Max 200 1.5 635 -65 to +150 Unit mW mW/C C/W C
ORDERING INFORMATION
Device NZ9FxxxST5G Package SOD-923 (Pb-Free) Shipping 8000/Tape & Reel
RqJA TJ, Tstg
For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D.
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. FR-4 Minimum Pad.
DEVICE MARKING INFORMATION
See specific marking information in the device marking column of the Electrical Characteristics table on page 3 of this data sheet.
(c) Semiconductor Components Industries, LLC, 2008
May, 2008 - Rev. 0
1
Publication Order Number: NZ9F2V4S/D
NZ9F2V4ST5G SERIES
ELECTRICAL CHARACTERISTICS
(TA = 25C unless otherwise noted, VF = 0.9 V Max. @ IF = 10 mA for all types) Symbol VZ IZT ZZT IZK ZZK IR VR IF VF QVZ C Parameter Reverse Zener Voltage @ IZT Reverse Current Maximum Zener Impedance @ IZT Reverse Current Maximum Zener Impedance @ IZK Reverse Leakage Current @ VR Reverse Voltage Forward Current Forward Voltage @ IF Maximum Temperature Coefficient of VZ Max. Capacitance @VR = 0 and f = 1 MHz VZ VR IR VF IZT V I IF
Figure 1. Zener Voltage Regulator
100 80 POWER DISSIPATION (%) 60 40 20 0
0
25
50
75
100
125
150
TEMPERATURE (C)
Figure 2. Steady State Power Derating
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NZ9F2V4ST5G SERIES
ELECTRICAL CHARACTERISTICS (VF = 0.9 Max @ IF = 10 mA for all types)
Zener Voltage VZ Device NZ9F2V4ST5G NZ9F2V7ST5G NZ9F3V0ST5G NZ9F3V3ST5G NZ9F3V6ST5G NZ9F3V9ST5G NZ9F4V3ST5G NZ9F4V7ST5G NZ9F5V1ST5G NZ9F5V6ST5G NZ9F6V2ST5G NZ9F6V8ST5G NZ9F7V5ST5G NZ9F8V2ST5G NZ9F9V1ST5G NZ9F10VST5G NZ9F11VST5G NZ9F12VST5G NZ9F13VST5G NZ9F15VST5G NZ9F16VST5G NZ9F18VST5G *Rotated 90. **Rotated 180. Device Marking 2* 3* 4* 5* 6* A** D** E** F** J** K** L** P** Q** R** T** V** Y** 2** 3** 4** 5** Min 2.43 2.67 2.94 3.32 3.6 3.89 4.17 4.55 4.989 5.49 6.06 6.65 7.28 8.02 8.85 9.77 10.76 11.74 12.91 14.34 15.85 17.56 Max 2.63 2.91 3.26 3.53 3.85 4.16 4.43 4.75 5.2 5.73 6.33 6.93 7.6 8.36 9.23 10.21 11.22 12.24 13.49 14.98 16.51 18.35 ZZT IZ = IZT @ 10% Mod W Max 100 100 100 100 100 100 100 100 80 60 60 40 30 30 30 30 30 30 37 42 50 50 ZZK IZ = 1.0 mA W Max 1000 1000 1000 1000 1000 1000 1000 800 500 200 100 60 60 60 60 60 60 80 80 80 80 80 Max IR @ VR IZK mA 1 1 1 1 1 1 1 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 mA 50 20 10 10 10 5 5 2 2 1 1 0.5 0.5 0.5 0.5 0.1 0.1 0.1 0.1 0.1 0.1 0.1 V 1 1 1 1 1 1 1 1 1.5 2.5 3 3.5 4 5 6 7 8 9 10 11 12 14 dVZ/dt (mV/k) @ IZT1 = 5 mA Min -3.5 -3.5 -3.5 -3.5 -3.5 -3.5 -3.5 -3.5 -2.7 -2.0 0.4 1.2 2.5 3.2 3.8 4.5 5.4 6 7 9.2 10.4 12.4 Max 0 0 0 0 0 -2.5 0 0.2 1.2 2.5 3.7 4.5 5.3 6.2 7 8 9 10 11 13 14 16
Test Current Izt mA 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5
CpF Max @ VR = 0 f = 1 MHz 210 210 210 210 210 210 210 150 130 115 110 105 100 90 80 80 80 80 75 70 65 60
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NZ9F2V4ST5G SERIES
PACKAGE DIMENSIONS
SOD-923 CASE 514AB-01 ISSUE B
D -X- -Y- E
1 2 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. DIM A b c D E HE L MILLIMETERS MIN NOM MAX 0.34 0.37 0.40 0.15 0.20 0.25 0.07 0.12 0.17 0.75 0.80 0.85 0.55 0.60 0.65 0.95 1.00 1.05 0.05 0.10 0.15 MIN 0.013 0.006 0.003 0.030 0.022 0.037 0.002 INCHES NOM 0.015 0.008 0.005 0.031 0.024 0.039 0.004 MAX 0.016 0.010 0.007 0.033 0.026 0.041 0.006
b
2X
0.08 (0.0032) X Y A
c
L HE
SOLDERING FOOTPRINT*
0.90 0.40
0.30
DIMENSIONS: MILLIMETERS
*For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. "Typical" parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303-675-2175 or 800-344-3860 Toll Free USA/Canada Fax: 303-675-2176 or 800-344-3867 Toll Free USA/Canada Email: orderlit@onsemi.com N. American Technical Support: 800-282-9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81-3-5773-3850 ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative
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NZ9F2V4S/D

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